![]() This cookie is set by GDPR Cookie Consent plugin. The cookies is used to store the user consent for the cookies in the category "Necessary". The cookie is set by GDPR cookie consent to record the user consent for the cookies in the category "Functional". The cookie is used to store the user consent for the cookies in the category "Analytics". ![]() The cookie is set by GDPR cookie consent to record the user consent for the cookies in the category "Advertisement". These cookies ensure basic functionalities and security features of the website, anonymously. Necessary cookies are absolutely essential for the website to function properly. Read the application note on how to use capacitance to measure wafer bow and warp. It describes the difference between bow and warp and explains two ways to construct a reference plane for warp measurements. The third section is specifically for the solar industry. The first two sections explain how to measure thickness, TTV, bow and warp between two capacitance-probes. MTI’s application note contains these definitions, includes calculations, and explains how its capacitance-based technologies work. The SDK and Amplifier take a lot of the hard work out of building an OEM system.ĪSTM standards provide the definitions for specific wafer characteristics. MTI’s photovoltaic/solar metrology system provides in-process monitoring for solar/PV wafers and measures thickness, TTV and bow.Īdditionally, MTI’s Digital Accumeasure Gen 3 capacitance amplifier and capacitance probes can be used to build custom OEM wafer metrology systems.The Proforma 300iSA is a semi-automated metrology system for semiconducting and semi-insulating wafers (up to 20k Ohm-cm) that performs full-surface scanning/mapping for thickness, TTV, bow, and warp (Fig 3 ).The Proforma 300i is a manual metrology system that measures thickness, 5 point TTV, and bow of semiconducting and semi-insulating wafers (up to 20k Ohm-cm).MTI Instruments of Albany, New York (USA) provides three capacitance-based metrology systems for non-contact wafer measurement. Three System Solutions to Wafer Measurement Challenges For a lower-cost, higher-precision solution, capacitance probes support a faster ROI and proven capabilities. When the tool is automated, the wafer shape is characterized with non-contact capacitive scanners, which can measure the thickness and shape of the rotating wafer.įig 2 MTI Wafer tools use opposing capacitance probes to measure flatness, thicknessĬapacitance probes cost significantly less than laser interferometers, which is another type of wafer measurement technology, yet capacitance sensors often exceed the performance of expensive interferometers with their stability, precision, and resolution. In Figure 2 below, the Proforma 300iSA semi-automated metrology system is on the left and the Proforma 300i manual semiconductor metrology system is on the right. The distance between these probes “G” is accurately known, and the gap “A” and “B” between the wafer and the probes is obtained from the capacitance at each measurement point. Capacitance probes use low voltage electric fields to measure the distance from the probe to the wafer.įig 1 Representation of Wafer TTV, Bow and Warp It is ideal for measurements of Silicon and other semiconductor materials.Ĭapacitance sensing can be used to measure wafer thickness, bow, warp, and total thickness variation (TTV) as represented in Fig 1. Proforma technology has a wide wafer thickness measurement range and provides excellent repeatability. These non-contact systems provide highly precise measurements of semiconducting and semi-insulating wafers up to 20k Ohm-cm. ![]() MTI Instruments’ Proforma 300i and 300iSA systems use capacitance sensors to improve yields while reducing costs through better dimensional control of critical wafer parameters. Non-contact capacitive sensing is a highly precise and cost-effective means to measure wafer flatness, bow, warp, and total thickness variation (TTV). Various measurement techniques exist to verify process tolerances and eliminate expensive scrap wafers. To ensure your wafer manufacturing process is within tolerance, you need to measure the wafers being produced. The flatness of silicon wafers used to manufacture integrated circuits is controlled to tight tolerances to help ensure that the whole wafer is sufficiently flat for lithographic processing. MHRA 'TTV', All Acronyms, 1 June 2023, Bluebook All Acronyms, TTV (Jun. TTV, All Acronyms, viewed June 1, 2023, MLA All Acronyms. Retrieved June 1, 2023, from Chicago All Acronyms. Facebook Twitter Linkedin Quote Copy APA All Acronyms.
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